Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
ITM = 24 A
tp = 380 µs
(1.21 V Typical)
Test Conditions
VD = 12 V
RL = 10 Ω
(3.5 mA Typical)
Test Conditions
VD = 12 V
RL = 10 Ω
(0.64 V Typical)
Test Conditions
IT = 100 mA
(8.7 mA Typical)
Test Conditions
VDRM = 200 V
Test Conditions
VDRM = 200 V
TC = 125 °C
Test Conditions
VD = 133 V
TC = 125 °C
Test Conditions
VRRM = 200 V
Test Conditions
VRRM = 200 V
TC = 125 °C
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CS220-12B | Sleeve@50 | Discontinued | 12A,200V Through-Hole SCR | EAR99 | 8541.30.0080 | PBFREE |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
Analytical Test Report:Tin Plating | Analytical Test Report |
CS220-12B.PDF | Device Datasheet |
Material Composition:TO-220 | Material Composition |
Package Detail Document:TO-220 | Package Detail Document |
Product EOL Notice:CS220 Series of SCRs | Product EOL Notice |
Product Reliability Data:TO-220 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development