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CS39-4D

4A,400V Through-Hole SCR

Case Type: TO-39

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Technical Specifications

Similar Products with Selected Specifications
Average Gate Power (PG(AV))
0.2 W
Forward Voltage (VTM)
1.95 V

(1.6 V Typical)

Gate Non-Trigger Voltage (VGD)
0.2 V
Gate Trigger Current (IGT)
200 µA

(38 µA Typical)

Gate Trigger Voltage (VGT)
0.8 V

(0.55 V Typical)

Holding Current (IH)
5 mA

(0.25 mA Typical)

Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current (IFGM)
1.2 A
Peak Gate Power (PGM)
3 W
Peak Off-State Blocking Current (IDRM)
5 µA
Peak Off-State Blocking Current (IDRM)
200 µA
Peak One Cycle Surge Current (ITSM)
35 A
Peak Repetitive Off-State Voltage (VDRM)
400 V
Peak Repetitive Reverse Voltage (VRRM)
400 V
Rate of Rise of Reverse Voltage (dv/dt)
10 V/µs
RMS On-State Current (IT(RMS))
4 A
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
180 °C/W
Thermal Resistance Junction-Case (ΘJC)
10 °C/W
ueak Reverse Blocking Current (IRRM)
5 µA
ueak Reverse Blocking Current (IRRM)
200 µA
Value For Fusing (I²T)
4.5 A2s

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CS39-4D Box@500 Active 4A,400V Through-Hole SCR EAR99 8541.30.0080 PBFREE

Resources

Item Type
Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Cap Analytical Test Report
Analytical Test Report:Header Analytical Test Report
Analytical Test Report:Header Assembly Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
CS39-4B.PDF Device Datasheet
Material Composition:TO-39 Material Composition
Package Detail Document:TO-39 Package Detail Document
Process Change Notice:CS39-4M Process Change Notice
Product Reliability Data:TO-39 Package Reliability Product Reliability Data

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