Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
ITM = 8 A
tp = 380 ms
(1.6 V Typical)
Test Conditions
VD = 12 V
RL = 10 Ω
(38 µA Typical)
Test Conditions
VD = 12 V
RL = 10 Ω
(550 mV Typical)
Test Conditions
IT = 50 mA
RGK = 1 kΩ
(0.25 mA Typical)
Test Conditions
VDRM = 600 V
RGK = 1 kΩ
Test Conditions
VDRM = 600 V
RGK = 1 kΩ
TC = 125 °C
Test Conditions
VD = 400 V
RGK = 1 kΩ
TC = 125 °C
Test Conditions
VRRM = 600 V
RGK = 1 kΩ
Test Conditions
VRRM = 600 V
RGK = 1 kΩ
TC = 125 °C
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CSD-4M BK | Box@150 | Discontinued, Stock Only | 4A,600V Surface mount SCR | EAR99 | 8541.30.0080 | PBFREE |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
CSD-4M.PDF | Device Datasheet |
Material Composition:DPAK | Material Composition |
Package Detail Document:DPAK | Package Detail Document |
Product Reliability Data:DPAK Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development