Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
ITM = 1.2 A
Test Conditions
VD = 400 V
RL = 100 Ω
TA = 125 °C
Test Conditions
VD = 7 V
RGK = 1 kΩ
RL = 100 Ω
Test Conditions
VD = 7 V
RGK = 1 kΩ
RL = 100 Ω
Test Conditions
VD = 7 V
RGK = 1 kΩ
Test Conditions
VDRM = 400 V
RGK = 1 kΩ
Test Conditions
VDRM = 400 V
RGK = 1 kΩ
TA = 125 °C
Test Conditions
VD = 400 V
IG = 1 mA
RGK = 1 kΩ
di/dt = 6 A/µs
Test Conditions
VRRM = 400 V
RGK = 1 kΩ
Test Conditions
VRRM = 400 V
RGK = 1 kΩ
TA = 125 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CTLS5064R-M532 TR | Tape & Reel@3,000 | Discontinued | 800mA,400V Surface mount SCR | EAR99 | 8541.30.0080 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| CTLS5064-M532.PDF | Device Datasheet |
| Package Detail Document:TLM532 | Package Detail Document |
| Product EOL Notice:BLANKET PDN-ALL OTHER PRODUCTS | Product EOL Notice |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development