CQ223-2M

2A,600V Surface mount TRIAC

Case Type: SOT-223

Average Gate Power (PG(AV))
200 mW
Forward Voltage (VTM)
1.75 V

(1.5 V Typical)

Forward Voltage (VTM)
2 V

(1.7 V Typical)

Gate Trigger Current (IGT)
5 mA

(1.35 mA Typical)

Gate Trigger Current (IGT)
8 mA

(3.75 mA Typical)

Gate Trigger Voltage (VGT)
1.8 V

(1.1 V Typical)

Holding Current (IH)
5 mA

(1.2 mA Typical)

Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current (IFGM)
1.2 A
Peak Gate Power (PGM)
3 W
Peak Off-State Blocking Current (IDRM)
5 µA
Peak Off-State Blocking Current (IDRM)
200 µA
Peak One Cycle Surge Current (ITSM)
10 A
Peak Repetitive Off-State Voltage (VDRM)
600 V
Peak Repetitive Reverse Voltage (VRRM)
600 V
Rate of Rise of Reverse Voltage (dv/dt)
2.5 V/µs
RMS On-State Current (IT(RMS))
2 A
Storage Temperature (Tstg)
-40 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
62.5 °C/W
ueak Reverse Blocking Current (IRRM)
5 µA
ueak Reverse Blocking Current (IRRM)
200 µA
Value For Fusing (I²T)
0.5 A2s

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CQ223-2M BK Box@350 Active 2A,600V Surface mount TRIAC EAR99 8541.30.0080 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CQ223-2M.PDF Device Datasheet
Material Composition:SOT-223 Material Composition
Package Detail Document:SOT-223 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-223 Process Change Notice
Product EOL Notice:All devices in SOT-223 Case Product EOL Notice
Product Reliability Data:SOT-223 Package Reliability Product Reliability Data
Step File 3D Object:SOT-223 Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

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  • Online technical data and parametric search
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  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development