Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
ITM = 2 A
tp = 380 µs
(1.5 V Typical)
Test Conditions
ITM = 3 A
tp = 380 µs
(1.7 V Typical)
Test Conditions
VD = 12 V
QUAD = 3
(1.35 mA Typical)
Test Conditions
VD = 12 V
QUAD = 4
(3.75 mA Typical)
Test Conditions
VD = 12 V
QUAD = 4
(1.1 V Typical)
Test Conditions
RGK = 1 kΩ
(1.2 mA Typical)
Test Conditions
VDRM = 800 V
RGK = 1 kΩ
Test Conditions
VDRM = 800 V
RGK = 1 kΩ
TC = 125 °C
Test Conditions
VD = 533 V
TC = 125 °C
Test Conditions
VRRM = 800 V
RGK = 1 kΩ
Test Conditions
VRRM = 800 V
RGK = 1 kΩ
TC = 125 °C
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CQ223-2N BK | Box@350 | End Of Life | 2A,800V Surface mount TRIAC | EAR99 | 8541.30.0080 | PBFREE | |
CQ223-2N TR | Tape & Reel@1,000 | End Of Life | 2A,800V Surface mount TRIAC | EAR99 | 8541.30.0080 | PBFREE |
Resources
Item | Type |
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No matching documents found. | |
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CQ223-2M.PDF | Device Datasheet |
Material Composition:SOT-223 | Material Composition |
Package Detail Document:SOT-223 | Package Detail Document |
Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
Product EOL Notice:All devices in SOT-223 Case | Product EOL Notice |
Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
Step File 3D Object:SOT-223 | Step File 3D Object |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development