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CQ89-2M

2A,600V Surface mount TRIAC

Case Type: SOT-89

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Technical Specifications

Similar Products with Selected Specifications
Average Gate Power (PG(AV))
200 mW
Forward Voltage (VTM)
1.75 V

(1.5 V Typical)

Forward Voltage (VTM)
2 V

(1.7 V Typical)

Gate Trigger Current (IGT)
5 mA

(1.35 mA Typical)

Gate Trigger Current (IGT)
8 mA

(3.75 mA Typical)

Gate Trigger Voltage (VGT)
1.8 V

(1.1 V Typical)

Holding Current (IH)
5 mA

(1.2 mA Typical)

Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current (IFGM)
1.2 A
Peak Forward Gate Voltage (VFGM)
8 V
Peak Gate Power (PGM)
3 W
Peak Off-State Blocking Current (IDRM)
5 µA
Peak Off-State Blocking Current (IDRM)
200 µA
Peak One Cycle Surge Current (ITSM)
20 A
Peak Repetitive Off-State Voltage (VDRM)
600 V
Peak Repetitive Reverse Voltage (VRRM)
600 V
Rate of Rise of Reverse Voltage (dv/dt)
2.5 V/µs
RMS On-State Current (IT(RMS))
2 A
Storage Temperature (Tstg)
-40 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
180 °C/W
Thermal Resistance Junction-Case (ΘJC)
90 °C/W
ueak Reverse Blocking Current (IRRM)
5 µA
ueak Reverse Blocking Current (IRRM)
200 µA
Value For Fusing (I²T)
2 A2s

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CQ89-2M TR Tape & Reel@1,000 Discontinued 2A,600V Surface mount TRIAC EAR99 8541.30.0080 PBFREE

Resources

Item Type
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CQ89-2M.PDF Device Datasheet
Material Composition:SOT-89 Material Composition
Package Detail Document:SOT-89 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-89 Process Change Notice
Product EOL Notice:CQ89-2M Product EOL Notice
Product Reliability Data:SOT-89 Package Reliability Product Reliability Data

Product Support

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Design Support

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
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  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development