2N5308

300mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington

Case Type: TO-92

Base-Emitter On Voltage (VBE(ON))
1.5 V
Base-Emitter Saturation Voltage (VBE(SAT))
1.6 V
Collector-Base Breakdown Voltage (BVCBO)
40 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Base Cutoff Current (ICBO)
20 µA
Collector-Base Voltage (VCBO)
40 V
Collector-Emitter Breakdown Voltage (BVCEO)
40 V
Collector-Emitter Saturation Voltage (VCE(SAT))
1.4 V
Collector-Emitter Voltage (VCEO)
40 V
Continuous Base Current (IB)
50 mA
Continuous Collector Current (IC)
300 mA
Current Gain-Bandwidth Product (fT)
60 MHz
DC Current Gain (hFE)
7 — 70 x103
DC Current Gain (hFE)
20 x103
Emitter-Base Breakdown Voltage (BVEBO)
12 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
12 V
Input Capacitance (Cib)
12 pF
Input Impedance Common Emitter (hie)
650 kΩ
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
10 pF
Peak Collector Current (ICM)
500 mA
Power Dissipation (PD)
625 mW
Power Dissipation (PD)
1.5 W
Small Signal Current Gain (hfe)
7 x103
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
83.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
2N5308 APM Ammo@2,000 Active 300mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington EAR99 8541.21.0095 LEAD or TIN
2N5308 APP Ammo@2,000 Active 300mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington EAR99 8541.21.0095 LEAD or TIN
2N5308 TRA Tape & Reel@2,000 Active 300mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington EAR99 8541.21.0095 LEAD or TIN
2N5308 TRE Tape & Reel@2,000 Active 300mA,40V Through-Hole Transistor-Small Signal (<=1A) NPN Darlington EAR99 8541.21.0095 LEAD or TIN

Resources

2N5306_5308.PDF Device Datasheet
Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Copper Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
Analytical Test Report:Tin Plating Analytical Test Report
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Process Change Notice:CP327V replacing CP307V Process Change Notice
Product Reliability Data:TO-92 Package Reliability Product Reliability Data

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