CJD112
2A,100V Surface mount Transistor-Bipolar Power (>1A) NPN Darlington
Case Type: DPAK
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 2 A
VCE = 3 V
Test Conditions
IC = 4 A
IB = 40 mA
Test Conditions
VCB = 80 V
Test Conditions
VCB = 100 V
Test Conditions
IC = 30 mA
Test Conditions
VCE = 50 V
Test Conditions
VCE = 80 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 80 V
VBE(OFF) = 1.5 V
TC = 125 °C
Test Conditions
IC = 2 A
IB = 8 mA
Test Conditions
IC = 4 A
IB = 40 mA
Test Conditions
VCE = 10 V
IC = 750 mA
f = 1 MHz
Test Conditions
VCE = 3 V
IC = 500 mA
Test Conditions
VCE = 3 V
IC = 2 A
Test Conditions
VCE = 3 V
IC = 4 A
Test Conditions
VEB = 5 V
Test Conditions
VCB = 10 V
f = 0.1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CJD112 BK | Box@150 | Discontinued, Stock Only | 2A,100V Surface mount Transistor-Bipolar Power (>1A) NPN Darlington | EAR99 | 8541.29.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CJD112-117.PDF | Device Datasheet |
| Material Composition:DPAK | Material Composition |
| Package Detail Document:DPAK | Package Detail Document |
| Product EOL Notice:DPAK TRANSISTORS | Product EOL Notice |
| Product Reliability Data:DPAK Package Reliability | Product Reliability Data |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development