CMPTA14E
500mA,40V Surface mount Transistor-Small Signal (<=1A) NPN Darlington
Case Type: SOT-23
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 5 V
Test Conditions
VCB = 40 V
Test Conditions
IC = 100 µA
(60 V Typical)
Test Conditions
IC = 100 mA
IB = 100 µA
(0.75 V Typical)
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 mA
(70 x103 Typical)
Test Conditions
VCE = 5 V
IC = 100 mA
(75 x103 Typical)
Test Conditions
VCE = 5 V
IC = 500 mA
(35 x103 Typical)
Test Conditions
VEB = 10 V
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CMPTA14E BK | Box@3,500 | Active | 500mA,40V Surface mount Transistor-Small Signal (<=1A) NPN Darlington | EAR99 | 8541.21.0075 | PBFREE | |
CMPTA14E TR | Tape & Reel@3,000 | Active | 500mA,40V Surface mount Transistor-Small Signal (<=1A) NPN Darlington | EAR99 | 8541.21.0075 | TIN |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Copper Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
CMPTA14E.PDF | Device Datasheet |
Material Composition:SOT-23 | Material Composition |
Package Detail Document:SOT-23 | Package Detail Document |
Process Change Notice:All Small Signal Transistor | Process Change Notice |
Process Change Notice:Copper Wire Bonding | Process Change Notice |
Process Change Notice:CP327V replacing CP307V | Process Change Notice |
Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development