CXTA14
500mA,30V Surface mount Transistor-Small Signal (<=1A) NPN Darlington
Case Type: SOT-89
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 mA
VCE = 5 V
Test Conditions
VCB = 30 V
Test Conditions
IC = 100 µA
Test Conditions
IC = 100 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 100 mA
Test Conditions
VEB = 10 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CXTA14 BK | Box@900 | End Of Life | 500mA,30V Surface mount Transistor-Small Signal (<=1A) NPN Darlington | EAR99 | 8541.29.0075 | PBFREE | |
| CXTA14 TR | Tape & Reel@1,000 | End Of Life | 500mA,30V Surface mount Transistor-Small Signal (<=1A) NPN Darlington | EAR99 | 8541.29.0075 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CXTA14&64.PDF | Device Datasheet |
| Material Composition:SOT-89 | Material Composition |
| Package Detail Document:SOT-89 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-89 | Process Change Notice |
| Process Change Notice:CP327V replacing CP307V | Process Change Notice |
| Product EOL Notice:All Devices in the SOT-89 | Product EOL Notice |
| Product Reliability Data:SOT-89 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CXTA14 | Spice Model |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development