CXTA27

500mA,60V Surface mount Transistor-Small Signal (<=1A) NPN Darlington

Case Type: SOT-89

Base-Emitter On Voltage (VBE(ON))
2 V
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Cutoff Current (ICBO)
100 nA
Collector-Emitter Breakdown Voltage (BVCES)
60 V
Collector-Emitter Cutoff Current (ICES)
500 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
1.5 V
Collector-Emitter Voltage (VCES)
60 V
Continuous Collector Current (IC)
500 mA
Current Gain-Bandwidth Product (fT)
125 MHz
DC Current Gain (hFE)
10 x103
DC Current Gain (hFE)
10 x103
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
10 V
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation (PD)
1.2 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
104 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CXTA27 BK Box@900 Active 500mA,60V Surface mount Transistor-Small Signal (<=1A) NPN Darlington EAR99 8541.29.0075 PBFREE

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CXTA27.PDF Device Datasheet
Material Composition:SOT-89 Material Composition
Package Detail Document:SOT-89 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-89 Process Change Notice
Process Change Notice:CP327V replacing CP307V Process Change Notice
Product EOL Notice:All Devices in the SOT-89 Product EOL Notice
Product Reliability Data:SOT-89 Package Reliability Product Reliability Data

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

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  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
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  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development