CZT2000
600mA,200V Surface mount Transistor-Small Signal (<=1A) NPN Darlington
Case Type: SOT-223
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 160 mA
VCE = 5 V
Test Conditions
VCB = 180 V
Test Conditions
IC = 1 mA
Test Conditions
IC = 20 mA
IB = 25 µA
Test Conditions
IC = 80 mA
IB = 40 µA
Test Conditions
IC = 160 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 160 mA
Test Conditions
VEB = 10 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CZT2000 BK | Box@350 | Active | 600mA,200V Surface mount Transistor-Small Signal (<=1A) NPN Darlington | EAR99 | 8541.29.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CZT2000.PDF | Device Datasheet |
| Material Composition:SOT-223 | Material Composition |
| Package Detail Document:SOT-223 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
| Product EOL Notice:All devices in SOT-223 Case | Product EOL Notice |
| Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CZT2000 | Spice Model |
| Step File 3D Object:SOT-223 | Step File 3D Object |
Product Support
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- Supply management (Customer portals)
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development