MJ1001
8A,80V Through-Hole Transistor-Bipolar Power (>1A) NPN Darlington
Case Type: TO-3
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 3 A
VCE = 3 V
Test Conditions
IC = 100 mA
Test Conditions
VCE = 80 V
RBE = 1 kΩ
Test Conditions
VCE = 80 V
RBE = 1 kΩ
TC = 150 °C
Test Conditions
VCE = 40 V
Test Conditions
IC = 3 A
IB = 12 mA
Test Conditions
IC = 8 A
IB = 40 mA
Test Conditions
VCE = 2 V
IC = 3 A
Test Conditions
VCE = 3 V
IC = 4 A
Test Conditions
VEB = 5 V
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
MJ1001 | Sleeve@20 | Discontinued | 8A,80V Through-Hole Transistor-Bipolar Power (>1A) NPN Darlington | EAR99 | 8541.29.0095 | PBFREE |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Cap and Assembly | Analytical Test Report |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Leads | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
LSSGP085.PDF | Device Datasheet |
Material Composition:TO-3 | Material Composition |
Package Detail Document:TO-3 | Package Detail Document |
Process Change Notice:2N6059 | Process Change Notice |
Process Change Notice:2N6059 | Process Change Notice |
Product EOL Notice:Power transistors bare die and | Product EOL Notice |
Product Reliability Data:TO-3 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development