2N2102A

65V,1A,1W Through-Hole Transistor-Small Signal (<=1A) NPN High Current

Case Type: TO-39

Base-Emitter Saturation Voltage (VBE(SAT))
1.1 V
Collector-Base Breakdown Voltage (BVCBO)
120 V
Collector-Base Cutoff Current (ICBO)
2 nA
Collector-Base Cutoff Current (ICBO)
2 µA
Collector-Base Voltage (VCBO)
120 V
Collector-Emitter Breakdown Voltage (BVCER)
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
65 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCER)
80 V
Collector-Emitter Voltage (VCEO)
65 V
Continuous Collector Current (IC)
1 A
Current Gain-Bandwidth Product (fT)
60 MHz
DC Current Gain (hFE)
10
DC Current Gain (hFE)
20
DC Current Gain (hFE)
35
DC Current Gain (hFE)
20
DC Current Gain (hFE)
40 — 120
DC Current Gain (hFE)
25
DC Current Gain (hFE)
10
Emitter-Base Breakdown Voltage (BVEBO)
7 V
Emitter-Base Cutoff Current (IEBO)
2 nA
Emitter-Base Voltage (VEBO)
7 V
Input Capacitance (Cib)
80 pF
Input Impedance Common Base (hib)
24 — 34 Ω
Input Impedance Common Base (hib)
4 — 8 Ω
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
6 dB
Output Admittance Common Base (hob)
0.08 — 0.5 µS
Output Admittance Common Base (hob)
0.08 — 1 µS
Output Capacitance (Cob)
15 pF
Power Dissipation (PD)
1 W
Power Dissipation (PD)
5 W
Small Signal Current Gain (hfe)
30 — 100
Small Signal Current Gain (hfe)
35 — 150
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient (ΘJA)
175 °C/W
Thermal Resistance Junction-Case (ΘJC)
35 °C/W
Voltage Feedback Ratio Common Base (hrb)
0.3 x10-3
Voltage Feedback Ratio Common Base (hrb)
0.3 x10-3

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
2N2102A Box@500 Active 65V,1A,1W Through-Hole Transistor-Small Signal (<=1A) NPN High Current EAR99 8541.29.0075 PBFREE

Resources

2N2102.PDF Device Datasheet
Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Cap Analytical Test Report
Analytical Test Report:Header Analytical Test Report
Analytical Test Report:Header Assembly Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
Material Composition:TO-39 Material Composition
Package Detail Document:TO-39 Package Detail Document
Product Reliability Data:TO-39 Package Reliability Product Reliability Data

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