2N3019
80V,1A,800mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current
Case Type: TO-39
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 90 V
Test Conditions
VCB = 90 V
TA = 150 °C
Test Conditions
VCB = 10 V
f = 4 MHz
IC = 10 mA
Test Conditions
IC = 30 mA
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
VCE = 10 V
IC = 50 mA
f = 20 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 150 mA
TA = -55 °C
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
VCE = 10 V
IC = 1 A
Test Conditions
IE = 100 µA
Test Conditions
VEB = 5 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
f = 1 kHz
RS = 1 kΩ
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N3019 | Box@500 | Active | 80V,1A,800mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current | EAR99 | 8541.21.0075 | LEAD or TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N3019 SERIES.PDF | Device Datasheet |
| Package Detail Document:TO-237 | Package Detail Document |
| Product EOL Notice:TO-237 Transisitors | Product EOL Notice |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development