2N3799A
90V,50mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise
Case Type: TO-18
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 µA
VCE = 5 V
Test Conditions
IC = 100 µA
IB = 10 µA
Test Conditions
IC = 1 mA
IB = 100 µA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 50 V
Test Conditions
VCB = 50 V
TA = 150 °C
Test Conditions
IC = 10 mA
Test Conditions
IC = 100 µA
IB = 10 µA
Test Conditions
IC = 1 mA
IB = 100 µA
Test Conditions
VCE = 5 V
IC = 500 µA
f = 30 MHz
Test Conditions
VCE = 5 V
IC = 1 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 100 µA
TA = -55 °C
Test Conditions
VCE = 5 V
IC = 500 µA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
VCE = 5 V
IC = 1 µA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 4 V
Test Conditions
VEB = 0.5 V
f = 100 kHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 10 V
IC = 100 µA
BW = 20 Hz
f = 100 Hz
RG = 3 kΩ
(2.5 dB Typical)
Test Conditions
VCE = 10 V
IC = 100 µA
BW = 200 Hz
f = 1 kHz
RG = 3 kΩ
(0.8 dB Typical)
Test Conditions
VCE = 10 V
IC = 100 µA
BW = 2 kHz
f = 10 kHz
RG = 3 kΩ
Test Conditions
VCE = 10 V
IC = 100 µA
f = 15.7 kHz
RG = 3 kΩ
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCB = 5 V
f = 100 kHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N3799A | Box@2,000 | Active | 90V,50mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise | EAR99 | 8541.21.0095 | LEAD or TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N3798.PDF | Device Datasheet |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |
Product Support
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Design Support
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- Custom product and package development