2N3859A
60V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise
Case Type: TO-92
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 mA
VCE = 1 mV
Test Conditions
IC = 100 µA
Test Conditions
VCB = 60 V
Test Conditions
VCB = 60 V
TA = 100 °C
Test Conditions
IC = 1 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
VCE = 10 V
IC = 2 mA
Test Conditions
VCE = 1 V
IC = 10 mA
Test Conditions
VCE = 4.5 V
IC = 2 mA
Test Conditions
IE = 100 µA
Test Conditions
VEB = 6 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N3859A | Box@2,500 | Discontinued, Stock Only | 60V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | EAR99 | 8541.21.0075 | PBFREE | |
| 2N3859A TRE | Tape & Reel@2,000 | Discontinued, Stock Only | 60V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N3859A.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |