2N3860

30V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise

Case Type: TO-92

Collector-Base Breakdown Voltage (BVCBO)
30 V
Collector-Base Cutoff Current (ICBO)
500 nA
Collector-Base Cutoff Current (ICBO)
10 µA
Collector-Base Voltage (VCBO)
30 V
Collector-Emitter Breakdown Voltage (BVCEO)
30 V
Collector-Emitter Saturation Voltage (VCE(SAT))
125 mV
Collector-Emitter Voltage (VCEO)
30 V
Continuous Collector Current (IC)
100 mA
Current Gain-Bandwidth Product (fT)
90 — 250 MHz
DC Current Gain (hFE)
150 — 300
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
4 V
Input Capacitance (Cib)
10 pF
Junction Temperature (Tj)
-55 — 125 °C
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
360 mW
Storage Temperature (Tstg)
-55 — 150 °C

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
2N3860 Box@2,500 Active 30V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0075 LEAD or TIN
2N3860 APM Ammo@2,000 Active 30V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0075 LEAD or TIN
2N3860 TRE Tape & Reel@2,000 Active 30V,100mA,360mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0075 LEAD or TIN

Resources

Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Lead Frame Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
LSSGP072.PDF Device Datasheet
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Product Reliability Data:TO-92 Package Reliability Product Reliability Data