2N3965

60V,200mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise

Case Type: TO-18

Base-Emitter Saturation Voltage (VBE(SAT))
900 mV
Base-Emitter Saturation Voltage (VBE(SAT))
950 mV
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Voltage (VCBO)
60 V
Collector-Emitter Breakdown Voltage (BVCES)
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
60 V
Collector-Emitter Cutoff Current (ICES)
10 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Voltage (VCEO)
60 V
Continuous Collector Current (IC)
200 mA
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
180
DC Current Gain (hFE)
250 — 500
DC Current Gain (hFE)
100
DC Current Gain (hFE)
250
DC Current Gain (hFE)
250 — 600
DC Current Gain (hFE)
800
DC Current Gain (hFE)
200
DC Current Gain (hFE)
180
DC Current Gain (hFE)
90
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage (VEBO)
6 V
Input Capacitance (Cib)
15 pF
Input Impedance Common Emitter (hie)
6 — 20 kΩ
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
2 dB
Noise Figure (NF)
2 dB
Noise Figure (NF)
2 dB
Noise Figure (NF)
4 dB
Noise Figure (NF)
8 dB
Output Admittance Common Emitter (hoe)
5 — 50 µS
Output Capacitance (Cob)
6 pF
Power Dissipation (PD)
1.2 W
Power Dissipation (PD)
360 mW
Small Signal Current Gain (hfe)
250 — 700
Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient (ΘJA)
486 °C/W
Thermal Resistance Junction-Case (ΘJC)
146 °C/W
Voltage Feedback Ratio Common Emitter (hre)
1 x10-3

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
2N3965 Box@2,000 Active 60V,200mA,360mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 PBFREE

Resources

Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Cap Analytical Test Report
Analytical Test Report:Header Analytical Test Report
Analytical Test Report:Header Assembly Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
LSSGP057.PDF Device Datasheet
Material Composition:TO-18 Material Composition
Package Detail Document:TO-18 Package Detail Document
Product Reliability Data:TO-18 Package Reliability Product Reliability Data

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