2N4400
40V,600mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Case Type: TO-92
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
IC = 100 µA
Test Conditions
IC = 1 mA
Test Conditions
VCE = 35 V
VEB = 400 mV
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
VCE = 10 V
IC = 20 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 1 mA
Test Conditions
VCE = 1 V
IC = 10 mA
Test Conditions
VCE = 1 V
IC = 150 mA
Test Conditions
VCE = 2 V
IC = 500 mA
Test Conditions
IE = 100 µA
Test Conditions
VEB = 0.5 V
f = 100 kHz
Test Conditions
VCB = 5 V
f = 100 kHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCC = 30 V
IC = 150 mA
IB1 = 15 mA
IB2 = 15 mA
Test Conditions
IC = 150 mA
IB1 = 15 mA
VCC = 30 V
VBE(OFF) = 2 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N4400 | Box@2,500 | Active | 40V,600mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | LEAD or TIN | |
| 2N4400 APM | Ammo@2,000 | Active | 40V,600mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | LEAD or TIN | |
| 2N4400 TRE | Tape & Reel@2,000 | Active | 40V,600mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | LEAD or TIN | |
| 2N4400-5 | Box@2,000 | Active | 40V,600mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | PBFREE | |
| 2N4400-5T1 | Box@2,000 | Active | 40V,600mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N4400.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:TO-92 process change eutectic | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
Product Support
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