2N5086

50V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise

Case Type: TO-92

Base-Emitter On Voltage (VBE(ON))
850 mV
Collector-Base Breakdown Voltage (BVCBO)
50 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
50 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCEO)
50 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
40 MHz
DC Current Gain (hFE)
150 — 500
DC Current Gain (hFE)
150
DC Current Gain (hFE)
150
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Voltage (VEBO)
3 V
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
3 dB
Noise Figure (NF)
3 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
625 mW
Power Dissipation (PD)
1.5 W
Small Signal Current Gain (hfe)
150 — 600
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
83.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
2N5086 Box@2,500 Active 50V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5086 APM Ammo@2,000 Active 50V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5086 APP Ammo@2,000 Active 50V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5086 TRA Tape & Reel@2,000 Active 50V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5086 TRE Tape & Reel@2,000 Active 50V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 LEAD or TIN

Resources

2N5086.PDF Device Datasheet
Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Copper Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
Analytical Test Report:Tin Plating Analytical Test Report
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Product Reliability Data:TO-92 Package Reliability Product Reliability Data
Spice Model:Spice Model 2N5086 Spice Model

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