Home / Products / Semiconductors / Transistors / General Purpose Transistors / 2N5088

2N5088

30V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise

Case Type: TO-92

Back to Top Specifications Ordering Resources

Technical Specifications

Similar Products with Selected Specifications
Base-Emitter On Voltage (VBE(ON))
800 mV
Collector-Base Breakdown Voltage (BVCBO)
35 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
35 V
Collector-Emitter Breakdown Voltage (BVCEO)
30 V
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Voltage (VCEO)
30 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
300 — 900
DC Current Gain (hFE)
350
DC Current Gain (hFE)
300
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
4.5 V
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
3 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
625 mW
Small Signal Current Gain (hfe)
350 — 1400
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
200 °C/W
Thermal Resistance Junction-Case (ΘJC)
83.3 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
2N5088 APM Ammo@2,000 Active 30V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5088 APP Ammo@2,000 Active 30V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5088 TRA Tape & Reel@2,000 Active 30V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5088 TRE Tape & Reel@2,000 Active 30V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0095 LEAD or TIN
2N5088-5T Box@2,000 Active 30V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise EAR99 8541.21.0095 PBFREE

Resources

Item Type
2N5088 SERIES.PDF Device Datasheet
Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Lead Frame Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Product Reliability Data:TO-92 Package Reliability Product Reliability Data
Spice Model:Spice Model 2N5088 Spice Model