2N5961
60V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise
Case Type: TO-92
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 1 mA
VCE = 5 V
Test Conditions
IC = 10 µA
Test Conditions
VCB = 60 V
Test Conditions
VCB = 60 V
TA = 65 °C
Test Conditions
IC = 5 mA
Test Conditions
IC = 10 mA
IB = 500 µA
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 5 V
Test Conditions
VEB = 0.5 V
Test Conditions
VCE = 5 V
IC = 100 µA
BW = 400 Hz
f = 1 kHz
RS = 1 kΩ
Test Conditions
VCE = 5 V
IC = 10 µA
BW = 400 Hz
f = 1 kHz
RS = 10 kΩ
Test Conditions
VCE = 5 V
IC = 10 µA
BW = 15.7 kHz
f = 10 kHz
RS = 1 kΩ
Test Conditions
VCB = 5 V
Test Conditions
VCE = 5 V
IC = 10 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N5961 | Box@2,500 | Discontinued | 60V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | EAR99 | 8541.21.0075 | LEAD or TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N5961-62-63.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product EOL Notice:CMPT930 | Product EOL Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
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