BC559C

30V,100mA,500mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise

Case Type: TO-92

Base-Emitter On Voltage (VBE(ON))
600 — 750 mV
Collector-Base Breakdown Voltage (BVCBO)
30 V
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Cutoff Current (ICBO)
4 µA
Collector-Base Voltage (VCBO)
30 V
Collector-Emitter Breakdown Voltage (BVCEO)
30 V
Collector-Emitter Breakdown Voltage (BVCEV)
30 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
650 mV
Collector-Emitter Voltage (VCEO)
30 V
Collector-Emitter Voltage (VCEV)
30 V
Continuous Collector Current (IC)
100 mA
Current Gain-Bandwidth Product (fT)
150 MHz
DC Current Gain (hFE)
420 — 800
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
5 V
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
4 dB

(1 dB Typical)

Output Capacitance (Cob)
4.5 pF
Peak Base Current (IBM)
200 mA
Peak Collector Current (ICM)
200 mA
Peak Emitter Current (IEM)
200 mA
Power Dissipation (PD)
500 mW
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
250 °C/W
Thermal Resistance Junction-Case (ΘJC)
150 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BC559C Box@2,000 Discontinued, Stock Only 30V,100mA,500mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0075 PBFREE

Resources

Analytical Test Report:Copper Bonding Wire Analytical Test Report
Analytical Test Report:Copper Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Free Analytical Test Report
Analytical Test Report:Pure Tin Solder, Sn Analytical Test Report
Analytical Test Report:Tin Plating Analytical Test Report
BC559C.PDF Device Datasheet
Material Composition:TO-92 Material Composition
Package Detail Document:TO-92 Package Detail Document
Product Reliability Data:TO-92 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development