BC846BW

65V,100mA,250mW Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch

Case Type: SOT-323

Base-Emitter On Voltage (VBE(ON))
580 — 700 mV
Base-Emitter On Voltage (VBE(ON))
770 mV
Base-Emitter Saturation Voltage (VBE(SAT))
700 mV
Base-Emitter Saturation Voltage (VBE(SAT))
900 mV
Collector-Base Breakdown Voltage (BVCBO)
80 V
Collector-Base Capacitance (Ccb)
4.5 pF
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Cutoff Current (ICBO)
5 µA
Collector-Base Voltage (VCBO)
80 V
Collector-Emitter Breakdown Voltage (BVCEO)
65 V
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
600 mV
Collector-Emitter Voltage (VCEO)
65 V
Continuous Collector Current (IC)
100 mA
DC Current Gain (hFE)
200 — 450
Emitter-Base Breakdown Voltage (BVEBO)
6 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
6 V
Junction Temperature (Tj)
-55 — 150 °C
Peak Base Current (IBM)
200 mA
Peak Collector Current (ICM)
200 mA
Power Dissipation (PD)
250 mW
Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BC846BW TR Tape & Reel@3,000 Active 65V,100mA,250mW Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch EAR99 8541.21.0095 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
BC846W_SERIES.PDF Device Datasheet
Material Composition:SOT-323 Material Composition
Package Detail Document:SOT-323 Package Detail Document
Process Change Notice:BC846AW thru BC857AW Series Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-323 Package Reliability Product Reliability Data
Step File 3D Object:SOT-323 (SC-70) Step File 3D Object

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development