BC858B

30V,100mA,330mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch

Case Type: SOT-23

Base-Emitter On Voltage (VBE(ON))
600 — 750 mV
Base-Emitter On Voltage (VBE(ON))
820 mV
Base-Emitter Saturation Voltage (VBE(SAT))
700 mV
Base-Emitter Saturation Voltage (VBE(SAT))
900 mV
Collector-Base Breakdown Voltage (BVCBO)
30 V
Collector-Base Capacitance (Ccb)
4.5 pF
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Cutoff Current (ICBO)
4 µA
Collector-Base Voltage (VCBO)
30 V
Collector-Emitter Breakdown Voltage (BVCEO)
30 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
650 mV
Collector-Emitter Voltage (VCEO)
30 V
Continuous Collector Current (IC)
100 mA
Current Gain-Bandwidth Product (fT)
100 MHz

(200 MHz Typical)

DC Current Gain (hFE)
220 — 475
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
100 nA
Emitter-Base Voltage (VEBO)
5 V
Junction Temperature (Tj)
-55 — 150 °C
Peak Base Current (IBM)
200 mA
Peak Collector Current (ICM)
200 mA
Power Dissipation (PD)
330 mW
Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
375 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BC858B BK Box@3,500 Active 30V,100mA,330mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch EAR99 8541.21.0075 PBFREE
BC858B TR Tape & Reel@3,000 Active 30V,100mA,330mW Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch EAR99 8541.21.0075 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
BC856-58ABC.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Small Signal Transistor Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Step File 3D Object:SOT-23 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development