BCW61B
32V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP Low Noise
Case Type: SOT-23
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 2 mA
VCE = 5 V
Test Conditions
IC = 10 mA
IB = 250 µA
Test Conditions
IC = 50 mA
IB = 1.25 mA
Test Conditions
IC = 2 mA
Test Conditions
VCE = 32 V
Test Conditions
VCE = 32 V
TA = 150 °C
Test Conditions
IC = 10 mA
IB = 250 µA
Test Conditions
IC = 50 mA
IB = 1.25 mA
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 2 mA
Test Conditions
VCE = 1 V
IC = 50 mA
Test Conditions
IE = 1 µA
Test Conditions
VCE = 5 V
IC = 200 µA
RS = 2 kΩ
BW = 200 Hz
f = 1 kHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 2 mA
f = 1 kHz
Test Conditions
IC = 10 mA
IB1 = 1 mA
VCC = 10 V
IB2 = 1 mA
RL = 990 Ω
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
RL = 990 Ω
IB2 = 1 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| BCW61B TR | Tape & Reel@3,000 | Active | 32V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP Low Noise | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| BCW61BCD_SERIES.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Small Signal Transistor | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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Design Support
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- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development