BCY58-X
32V,100mA,340mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise
Case Type: TO-18
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 mA
IB = 250 µA
Test Conditions
IC = 100 mA
IB = 2.5 mA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 32 V
Test Conditions
VCB = 32 V
TA = 150 °C
Test Conditions
IC = 2 mA
Test Conditions
IC = 10 mA
IB = 250 µA
Test Conditions
IC = 100 mA
IB = 2.5 mA
Test Conditions
VCE = 5 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
Test Conditions
VCE = 5 V
IC = 2 mA
Test Conditions
VCE = 1 V
IC = 10 mA
Test Conditions
VCE = 1 V
IC = 100 mA
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VCC = 10 V
IC = 100 mA
IB1 = 10 mA
IB2 = 10 mA
Test Conditions
IE = 1 µA
Test Conditions
VEB = 5 V
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VCC = 10 V
IC = 100 mA
IB1 = 10 mA
IB2 = 10 mA
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 200 µA
RS = 2 kΩ
BW = 200 Hz
f = 1 kHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCC = 10 V
IC = 100 mA
IB1 = 10 mA
IB2 = 10 mA
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VCC = 10 V
IC = 100 mA
IB1 = 10 mA
IB2 = 10 mA
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
(450 ns Typical)
Test Conditions
VCC = 10 V
IC = 100 mA
IB1 = 10 mA
IB2 = 10 mA
(450 ns Typical)
Test Conditions
VCC = 10 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
(85 ns Typical)
Test Conditions
VCC = 10 V
IC = 100 mA
IB1 = 10 mA
IB2 = 10 mA
(55 ns Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| BCY58-X | Box@2,000 | Active | 32V,100mA,340mW Through-Hole Transistor-Small Signal (<=1A) NPN Low Noise | EAR99 | 8541.21.0075 | LEAD or TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| BCY58-59.PDF | Device Datasheet |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |
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