BCY79-IX

45V,100mA,340mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise

Case Type: TO-18

Base-Emitter On Voltage (VBE(ON))
600 — 750 mV
Base-Emitter Saturation Voltage (VBE(SAT))
600 — 850 mV
Base-Emitter Saturation Voltage (VBE(SAT))
700 — 1200 mV
Collector-Base Breakdown Voltage (BVCBO)
45 V
Collector-Base Cutoff Current (ICBO)
15 nA
Collector-Base Cutoff Current (ICBO)
10 µA
Collector-Base Voltage (VCBO)
45 V
Collector-Emitter Breakdown Voltage (BVCEO)
45 V
Collector-Emitter Saturation Voltage (VCE(SAT))
250 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
800 mV
Collector-Emitter Voltage (VCEO)
45 V
Continuous Collector Current (IC)
100 mA
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
40
DC Current Gain (hFE)
250 — 460
DC Current Gain (hFE)
160 — 630
DC Current Gain (hFE)
60
Delay Time (td)
50 ns
Delay Time (td)
35 ns
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Cutoff Current (IEBO)
20 nA
Emitter-Base Voltage (VEBO)
5 V
Fall Time (tf)
100 ns
Fall Time (tf)
100 ns
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
10 dB
Output Capacitance (Cob)
7 pF
Peak Base Current (IBM)
200 mA
Peak Collector Current (ICM)
200 mA
Power Dissipation (PD)
340 mW
Power Dissipation (PD)
1 W
Rise Time (tr)
65 ns
Rise Time (tr)
50 ns
Storage Temperature (Tstg)
-65 — 200 °C
Storage Time (ts)
600 ns
Storage Time (ts)
300 ns
Thermal Resistance Junction-Ambient (ΘJA)
450 °C/W
Thermal Resistance Junction-Case (ΘJC)
150 °C/W
Turn Off Time (toff)
700 ns
Turn Off Time (toff)
400 ns
Turn On Time (ton)
100 ns
Turn On Time (ton)
100 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BCY79-IX Box@2,000 Limited Availability 45V,100mA,340mW Through-Hole Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0075 LEAD or TIN

Resources

Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Cap Analytical Test Report
Analytical Test Report:Header Analytical Test Report
Analytical Test Report:Header Assembly Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
BCY78-79.PDF Device Datasheet
Material Composition:TO-18 Material Composition
Package Detail Document:TO-18 Package Detail Document
Product Reliability Data:TO-18 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development