BFY90

15V,25mA,200mW Through-Hole Transistor-Small Signal (<=1A) NPN RF Oscillator

Case Type: TO-72

Amplifier Power Gain (Gpe)
21 dB

(23 dB Typical)

Amplifier Power Gain (Gpe)
8 dB
Collector-Base Breakdown Voltage (BVCBO)
30 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Voltage (VCBO)
30 V
Collector-Emitter Breakdown Voltage (BVCER)
30 V
Collector-Emitter Breakdown Voltage (BVCEO)
15 V
Collector-Emitter Voltage (VCER)
30 V
Collector-Emitter Voltage (VCEO)
15 V
Continuous Collector Current (IC)
25 mA
Current Gain-Bandwidth Product (fT)
1000 MHz

(1100 MHz Typical)

Current Gain-Bandwidth Product (fT)
1300 MHz

(1400 MHz Typical)

DC Current Gain (hFE)
25 — 150
DC Current Gain (hFE)
20 — 125
Emitter-Base Breakdown Voltage (BVEBO)
2.5 V
Emitter-Base Voltage (VEBO)
2.5 V
Junction Temperature (Tj)
-65 — 200 °C
Noise Figure (NF)
3.5 dB

(2.5 dB Typical)

Noise Figure (NF)
5 dB
Noise Figure (NF)
5.5 dB
Noise Figure (NF)
4 dB
Output Capacitance (Cob)
1.5 pF
Peak Collector Current (ICM)
50 mA
Power Dissipation (PD)
200 mW
Power Dissipation (PD)
300 mW
Power Output (Pout)
10 mW

(12 mW Typical)

Reverse Capacitance (Cre)
0.8 pF

(0.6 pF Typical)

Storage Temperature (Tstg)
-65 — 200 °C
Thermal Resistance Junction-Ambient (ΘJA)
875 °C/W
Thermal Resistance Junction-Case (ΘJC)
583 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BFY90 Box@2,000 Active 15V,25mA,200mW Through-Hole Transistor-Small Signal (<=1A) NPN RF Oscillator EAR99 8541.21.0075 LEAD or TIN

Resources

Analytical Test Report:Aluminum Wire Analytical Test Report
Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Epoxy Adhesive Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
BFX89-BFY90.PDF Device Datasheet
Material Composition:TO-72 Material Composition
Package Detail Document:TO-72 Package Detail Document
Process Change Notice:HEADER TO-72 Process Change Notice
Process Change Notice:TO-72 Case Process Change Notice
Process Change Notice:TO-72 CASE Process Change Notice
Product Reliability Data:TO-72 Package Reliability Product Reliability Data
Spice Model:Spice Model BFY90 Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development