BSY56
80V,750mA,800mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current
Case Type: TO-39
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 90 V
Test Conditions
VCB = 90 V
TA = 150 °C
Test Conditions
IC = 10 mA
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
VCE = 10 V
IC = 50 mA
f = 50 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 5 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 10 V
IC = 300 µA
f = 15 kHz
RG = 1.5 kΩ
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| BSY56 | Box@500 | Active | 80V,750mA,800mW Through-Hole Transistor-Small Signal (<=1A) NPN High Current | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| LSSGP067.PDF | Device Datasheet |
| Material Composition:TO-39 | Material Composition |
| Package Detail Document:TO-39 | Package Detail Document |
| Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
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- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development