CMKT5088

30V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual NPN Low Noise Amplifier

Case Type: SOT-363

Base-Emitter Saturation Voltage (VBE(SAT))
800 mV
Collector-Base Breakdown Voltage (BVCBO)
35 V
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
35 V
Collector-Emitter Breakdown Voltage (BVCEO)
30 V
Collector-Emitter Saturation Voltage (VCE(SAT))
500 mV
Collector-Emitter Voltage (VCEO)
30 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
50 MHz
DC Current Gain (hFE)
300 — 900
DC Current Gain (hFE)
350
DC Current Gain (hFE)
300
Emitter-Base Breakdown Voltage (BVEBO)
4.5 V
Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Voltage (VEBO)
4.5 V
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
3 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
350 mW
Small Signal Current Gain (hfe)
350 — 1400
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMKT5088 BK Box@5,000 Active 30V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual NPN Low Noise Amplifier EAR99 8541.21.0095 PBFREE

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMKT5087_SERIES.PDF Device Datasheet
Material Composition:SOT-363 Material Composition
Package Detail Document:SOT-363 Package Detail Document
Product Reliability Data:SOT-363 Package Reliability Product Reliability Data
Spice Model:Spice Model CMKT5088 Spice Model
Step File 3D Object:SOT-363 (SC-88) Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
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  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development