CMLT5088E

50V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual NPN Low Noise Amplifier

Case Type: SOT-563

Base-Emitter Saturation Voltage (VBE(SAT))
800 mV

(700 mV Typical)

Collector-Base Breakdown Voltage (BVCBO)
50 V

(135 V Typical)

Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
50 V

(65 V Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
100 mV

(45 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV

(110 mV Typical)

Collector-Emitter Voltage (VCEO)
50 V
Continuous Collector Current (IC)
100 mA
Current Gain-Bandwidth Product (fT)
100 MHz
DC Current Gain (hFE)
300 — 900

(430 Typical)

DC Current Gain (hFE)
300

(435 Typical)

DC Current Gain (hFE)
300

(430 Typical)

DC Current Gain (hFE)
50

(125 Typical)

Emitter-Base Breakdown Voltage (BVEBO)
5 V

(8.7 V Typical)

Emitter-Base Cutoff Current (IEBO)
50 nA
Emitter-Base Voltage (VEBO)
5 V
Input Capacitance (Cib)
15 pF
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
3 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
350 mW
Small Signal Current Gain (hfe)
350 — 1400
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLT5088E BK Box@5,000 Active 50V,100mA,350mW Surface mount Transistor-Small Signal (<=1A) Dual NPN Low Noise Amplifier EAR99 8541.21.0075 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLT5078E_SERIES.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:I-Spice Model CMLT5088E Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development