CMPT3019
80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN High Current
Case Type: SOT-23
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 90 V
Test Conditions
IC = 30 mA
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 500 mA
IB = 50 mA
Test Conditions
VCE = 10 V
IC = 50 mA
f = 20 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
IE = 100 µA
Test Conditions
VEB = 5 V
Test Conditions
VEB = 500 mV
f = 1 MHz
Test Conditions
VCE = 10 V
IC = 100 µA
RS = 1 kΩ
f = 1 kHz
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMPT3019 BK | Box@3,500 | Active | 80V,500mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN High Current | EAR99 | 8541.21.0075 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| CMPT3019.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Small Signal Transistor | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPT3019 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development