CMPT918
15V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN RF Oscillator
Case Type: SOT-23
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
f = 200 MHz
IC = 6 mA
VCB = 12 V
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 1 µA
Test Conditions
VCB = 15 V
Test Conditions
IC = 3 mA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
VCE = 10 V
IC = 4 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 3 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 500 mV
f = 1 MHz
Test Conditions
VCE = 6 V
IC = 1 mA
RS = 50 Ω
f = 60 MHz
Test Conditions
f = 1 MHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
IC = 8 mA
f = 500 MHz
VCB = 15 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMPT918 BK | Box@3,500 | Active | 15V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN RF Oscillator | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| CMPT918.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Small Signal Transistor | Process Change Notice |
| Process Change Notice:CMPT5179 / CMPT918 / CEN1056A | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPT918 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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Design Support
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- Online technical data and parametric search
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- Custom electrical curves
- Environmental regulation compliance
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development