CMPTA94
400V,300mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP High Voltage
Case Type: SOT-23
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 100 µA
Test Conditions
VCB = 350 V
Test Conditions
IC = 1 mA
Test Conditions
IC = 100 µA
Test Conditions
VCE = 350 V
Test Conditions
IC = 1 mA
IB = 100 µA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
VCE = 10 V
IC = 10 mA
f = 10 MHz
Test Conditions
VCE = 10 V
IC = 1 mA
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 50 mA
Test Conditions
VCE = 10 V
IC = 100 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 4 V
Test Conditions
VEB = 500 mV
f = 1 MHz
Test Conditions
VCB = 20 V
f = 1 MHz
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CMPTA94 BK | Box@3,500 | Active | 400V,300mA,350mW Surface mount Transistor-Small Signal (<=1A) PNP High Voltage | EAR99 | 8541.21.0095 | PBFREE |
Resources
Item | Type |
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No matching documents found. | |
Analytical Test Report:Copper Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
CMPTA94_R1.PDF | Device Datasheet |
Material Composition:SOT-23 | Material Composition |
Package Detail Document:SOT-23 | Package Detail Document |
Process Change Notice:All Small Signal Transistor | Process Change Notice |
Process Change Notice:Copper Wire Bonding | Process Change Notice |
Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
Spice Model:I-Spice Model CMPTA94 | Spice Model |
Spice Model:P-Spice Model CMPTA94 | Spice Model |
Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
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Design Support
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- Package details
- Application notes
- Application and design sample kits
- Custom product and package development