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CMST2907A

Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch

Case Type: SOT-323

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Technical Specifications

Similar Products with Selected Specifications
Base-Emitter Saturation Voltage (VBE(SAT))
1.3 V
Base-Emitter Saturation Voltage (VBE(SAT))
2.6 V
Collector-Base Breakdown Voltage (BVCBO)
60 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Cutoff Current (ICBO)
10 µA
Collector-Base Voltage (VCBO)
60 V
Collector-Emitter Breakdown Voltage (BVCEO)
60 V
Collector-Emitter Cutoff Current (ICEV)
50 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
400 mV
Collector-Emitter Saturation Voltage (VCE(SAT))
1.6 V
Collector-Emitter Voltage (VCEO)
60 V
Continuous Collector Current (IC)
600 mA
Current Gain-Bandwidth Product (fT)
200 MHz
DC Current Gain (hFE)
75
DC Current Gain (hFE)
100
DC Current Gain (hFE)
100
DC Current Gain (hFE)
100 — 300
DC Current Gain (hFE)
50
Delay Time (td)
10 ns
Emitter-Base Breakdown Voltage (BVEBO)
5 V
Emitter-Base Voltage (VEBO)
5 V
Fall Time (tf)
30 ns
Input Capacitance (Cib)
30 pF
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
8 pF
Power Dissipation (PD)
275 mW
Rise Time (tr)
40 ns
Storage Temperature (Tstg)
-65 — 150 °C
Storage Time (ts)
80 ns
Thermal Resistance Junction-Ambient (ΘJA)
455 °C/W
Turn Off Time (toff)
100 ns
Turn On Time (ton)
45 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMST2907A BK Box@5,000 Active Surface mount Transistor-Small Signal (<=1A) PNP General Purpose Amplifier/Switch EAR99 8541.21.0075 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMST2907A.PDF Device Datasheet
Material Composition:SOT-323 Material Composition
Package Detail Document:SOT-323 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-323 Package Reliability Product Reliability Data
Spice Model:Spice Model CMST2907A Spice Model
Step File 3D Object:SOT-323 (SC-70) Step File 3D Object

Product Support

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

Design Support

Contact Design Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development