CMST5087

50V,50mA,275mW Surface mount Transistor-Small Signal (<=1A) PNP Low Noise

Case Type: SOT-323

Base-Emitter Saturation Voltage (VBE(SAT))
850 mV
Collector-Base Breakdown Voltage (BVCBO)
50 V
Collector-Base Cutoff Current (ICBO)
10 nA
Collector-Base Cutoff Current (ICBO)
50 nA
Collector-Base Voltage (VCBO)
50 V
Collector-Emitter Breakdown Voltage (BVCEO)
50 V
Collector-Emitter Saturation Voltage (VCE(SAT))
300 mV
Collector-Emitter Voltage (VCEO)
50 V
Continuous Collector Current (IC)
50 mA
Current Gain-Bandwidth Product (fT)
40 MHz
DC Current Gain (hFE)
250 — 800
DC Current Gain (hFE)
250
DC Current Gain (hFE)
250
Emitter-Base Breakdown Voltage (BVEBO)
3 V
Emitter-Base Voltage (VEBO)
3 V
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
2 dB
Noise Figure (NF)
2 dB
Output Capacitance (Cob)
4 pF
Power Dissipation (PD)
275 mW
Small Signal Current Gain (hfe)
250 — 900
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
455 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMST5087 BK Box@5,000 Active 50V,50mA,275mW Surface mount Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 TIN
CMST5087 TR Tape & Reel@3,000 Active 50V,50mA,275mW Surface mount Transistor-Small Signal (<=1A) PNP Low Noise EAR99 8541.21.0095 LEAD or TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMST5086-87.PDF Device Datasheet
Material Composition:SOT-323 Material Composition
Package Detail Document:SOT-323 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOT-323 Package Reliability Product Reliability Data
Spice Model:Spice Model CMST5087 Spice Model
Step File 3D Object:SOT-323 (SC-70) Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development