CXT3904
40V,200mA,1.2W Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Case Type: SOT-89
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VCE = 30 V
VBE(OFF) = 3 V
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
IC = 10 µA
Test Conditions
IC = 1 mA
Test Conditions
VCE = 30 V
VBE(OFF) = 3 V
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
IC = 50 mA
IB = 5 mA
Test Conditions
VCE = 20 V
IC = 10 mA
f = 100 MHz
Test Conditions
VCE = 1 V
IC = 100 µA
Test Conditions
VCE = 1 V
IC = 1 mA
Test Conditions
VCE = 1 V
IC = 10 mA
Test Conditions
VCE = 1 V
IC = 50 mA
Test Conditions
VCE = 1 V
IC = 100 mA
Test Conditions
VCC = 3 V
IC = 10 mA
IB1 = 1 mA
VBE = 500 mV
Test Conditions
IE = 10 µA
Test Conditions
VCC = 3 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VEB = 500 mV
f = 1 MHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCE = 5 V
IC = 100 µA
RS = 1 kΩ
f = 15.7 kHz
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCB = 5 V
f = 1 MHz
Test Conditions
VCC = 3 V
IC = 10 mA
IB1 = 1 mA
VBE = 500 mV
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Test Conditions
VCC = 3 V
IC = 10 mA
IB1 = 1 mA
IB2 = 1 mA
Test Conditions
VCE = 10 V
IC = 1 mA
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CXT3904 BK | Box@900 | Active | 40V,200mA,1.2W Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.29.0075 | PBFREE | |
| CXT3904 TR | Tape & Reel@1,000 | Active | 40V,200mA,1.2W Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.29.0075 | LEAD or TIN | |
| CXT3904 TR13 | Tape & Reel@4,000 | End Of Life | 40V,200mA,1.2W Surface mount Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.29.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CXT3904&06.PDF | Device Datasheet |
| Material Composition:SOT-89 | Material Composition |
| Package Detail Document:SOT-89 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-89 | Process Change Notice |
| Process Change Notice:CP192V/CP592V DIE SHRINK | Process Change Notice |
| Product EOL Notice:All Devices in the SOT-89 | Product EOL Notice |
| Product Reliability Data:SOT-89 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CXT3904 | Spice Model |
Product Support
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Design Support
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- Application and design sample kits
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