CZTUX87
450V,500mA,2W Surface mount Transistor-Small Signal (<=1A) NPN High Voltage
Case Type: SOT-223
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 200 mA
IB = 20 mA
Test Conditions
IC = 30 mA
Test Conditions
VCE = 900 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 900 V
VBE(OFF) = 1.5 V
TA = 125 °C
Test Conditions
IC = 100 mA
IB = 10 mA
Test Conditions
IC = 200 mA
IB = 20 mA
Test Conditions
VCE = 10 V
IC = 50 mA
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 40 mA
Test Conditions
VEB = 5 V
Test Conditions
VCC = 250 V
IC = 200 mA
IB1 = 40 mA
IB2 = 80 mA
Test Conditions
VCC = 250 V
IC = 200 mA
IB1 = 40 mA
IB2 = 80 mA
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CZTUX87 BK | Box@350 | Discontinued | 450V,500mA,2W Surface mount Transistor-Small Signal (<=1A) NPN High Voltage | EAR99 | 8541.29.0095 | PBFREE |
Resources
Item | Type |
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No matching documents found. | |
Analytical Test Report:Copper Bond Wire | Analytical Test Report |
Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Gold Bond Wire | Analytical Test Report |
Analytical Test Report:Lead frame | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
CZTUX87.PDF | Device Datasheet |
Material Composition:SOT-223 | Material Composition |
Package Detail Document:SOT-223 | Package Detail Document |
Process Change Notice:Copper Wire Bonding - SOT-223 | Process Change Notice |
Product EOL Notice:CP250-CZTUX87 | Product EOL Notice |
Product Reliability Data:SOT-223 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CZTUX87 | Spice Model |
Step File 3D Object:SOT-223 | Step File 3D Object |
Product Support
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- Supply management (Customer portals)
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development