MJE13007
400V,8A,80W Through-Hole Transistor-Bipolar Power (>1A) NPN High Voltage
Case Type: TO-220
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 2 A
IB = 0.4 A
Test Conditions
IC = 5 A
IB = 1 A
Test Conditions
IC = 5 A
IB = 1 A
TJ = 100 °C
Test Conditions
IC = 10 mA
Test Conditions
VCE = 700 V
VBE(OFF) = 1.5 V
Test Conditions
VCE = 700 V
VBE(OFF) = 1.5 V
TC = 100 °C
Test Conditions
IC = 2 A
IB = 0.4 A
Test Conditions
IC = 5 A
IB = 1 A
Test Conditions
IC = 8 A
IB = 2 A
Test Conditions
IC = 5 A
IB = 1 A
TC = 100 °C
Test Conditions
VCE = 10 V
IC = 500 mA
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 2 A
Test Conditions
VCE = 5 V
IC = 5 A
Test Conditions
VEB = 9 V
Test Conditions
VCB = 10 V
f = 100 kHz
Test Conditions
VCE = 40 V
tp = 1 s
Test Conditions
VCE = 300 V
tp = 1 s
IB1 = 2.5 A
VBE(OFF) = 9 V
TC = 100 °C
Test Conditions
VCC = 125 V
IC = 5 A
IB1 = 1 A
IB2 = 1 A
tp = 25 µs
Test Conditions
VCC = 125 V
IC = 5 A
IB1 = 1 A
IB2 = 1 A
tp = 25 µs
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| MJE13007 | Sleeve@50 | Discontinued | 400V,8A,80W Through-Hole Transistor-Bipolar Power (>1A) NPN High Voltage | EAR99 | 8541.29.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| Material Composition:TO-220 | Material Composition |
| MJE13006.PDF | Device Datasheet |
| Package Detail Document:TO-220 | Package Detail Document |
| Product EOL Notice:BU406 / MJE13007 | Product EOL Notice |
| Product Reliability Data:TO-220 Package Reliability | Product Reliability Data |
Product Support
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Design Support
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- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development