MPQ2484
40V,50mA,500mW Through-Hole Transistor-Quad NPN General Purpose Amplifier/Switch
Case Type: TO-116
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 100 µA
VCE = 5 V
Test Conditions
IC = 10 mA
VCE = 5 V
Test Conditions
IC = 10 µA
Test Conditions
VCB = 45 V
Test Conditions
IC = 10 mA
Test Conditions
IC = 1 mA
IB = 100 µA
Test Conditions
IC = 10 mA
IB = 1 mA
Test Conditions
VCE = 5 V
IC = 500 µA
f = 20 MHz
Test Conditions
VCE = 5 V
IC = 100 µA
Test Conditions
VCE = 5 V
IC = 1 mA
Test Conditions
VCE = 5 V
IC = 10 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 3 V
Test Conditions
VEB = 0.5 V
f = 1 MHz
Test Conditions
VCE = 5 V
IC = 10 µA
BW = 10 kHz
f = 15.7 kHz
RS = 10 kΩ
Test Conditions
VCB = 5 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| MPQ2484 | Sleeve@25 | Discontinued | 40V,50mA,500mW Through-Hole Transistor-Quad NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| LSSGP079.PDF | Device Datasheet |
| Material Composition:TO-116 | Material Composition |
| Package Detail Document:TO-116 | Package Detail Document |
| Product EOL Notice:TO-116 CASE | Product EOL Notice |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development