MPQ2907
40V,600mA,650mW Through-Hole Transistor-Quad PNP General Purpose Amplifier/Switch
Case Type: TO-116
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 300 mA
IB = 30 mA
Test Conditions
IC = 10 µA
Test Conditions
VCB = 30 V
Test Conditions
IC = 10 mA
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
IC = 300 mA
IB = 30 mA
Test Conditions
VCE = 20 V
IC = 50 mA
f = 100 MHz
Test Conditions
VCE = 10 V
IC = 10 mA
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 300 mA
Test Conditions
IE = 10 µA
Test Conditions
VEB = 3 V
Test Conditions
VEB = 2 V
f = 1 MHz
Test Conditions
VCB = 10 V
f = 1 MHz
Test Conditions
VCC = 6 V
IC = 150 mA
IB1 = 15 mA
IB2 = 15 mA
Test Conditions
VCC = 30 V
IC = 150 mA
IB1 = 15 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| MPQ2907 | Sleeve@25 | Discontinued | 40V,600mA,650mW Through-Hole Transistor-Quad PNP General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Material Composition:TO-116 | Material Composition |
| MPQ2906-2907.PDF | Device Datasheet |
| Package Detail Document:TO-116 | Package Detail Document |
| Product EOL Notice:TO-116 CASE | Product EOL Notice |
Product Support
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development