PN3643
30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
Case Type: TO-92
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
f = 30 MHz
VCE = 15 V
PIN = 40 mW
RG = 140 Ω
RL = 260 Ω
Test Conditions
f = 30 MHz
VCE = 15 V
PIN = 40 mW
RG = 140 Ω
RL = 260 Ω
Test Conditions
IC = 10 µA
Test Conditions
IC = 10 mA
Test Conditions
IC = 10 µA
Test Conditions
VCE = 50 V
Test Conditions
IC = 150 mA
IB = 15 mA
Test Conditions
VCE = 5 V
IC = 50 mA
f = 100 MHz
Test Conditions
VCE = 10 V
IC = 150 mA
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
IE = 10 µA
Test Conditions
VCB = 10 V
f = 140 kHz
Test Conditions
IC = 300 mA
IB1 = 30 mA
IB2 = 30 mA
Test Conditions
IC = 300 mA
IB1 = 30 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| PN3643 | Box@2,500 | Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | LEAD or TIN | |
| PN3643 APM | Ammo@2,000 | Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | LEAD or TIN | |
| PN3643 TRE | Tape & Reel@2,000 | Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | LEAD or TIN | |
| PN3643-18 | Box@2,000 | Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | PBFREE | |
| PN3643-5 | Box@2,000 | Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | PBFREE | |
| PN3643-5T | Box@2,000 | Active | 30V,500mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N3641-3643.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:TO-92 process change eutectic | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |