CMXT3090L
15V,3A,350mW Surface mount Transistor-Bipolar Power (>1A) NPN Low VCE(SAT)
Case Type: SOT-26
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IC = 10 µA
Test Conditions
VCB = 20 V
Test Conditions
IC = 10 mA
Test Conditions
IC = 100 mA
IB = 1 mA
(30 mV Typical)
Test Conditions
IC = 1 A
IB = 20 mA
(60 mV Typical)
Test Conditions
IC = 2 A
IB = 200 mA
(85 mV Typical)
Test Conditions
IC = 3 A
IB = 60 mA
(145 mV Typical)
Test Conditions
VCE = 10 V
IC = 500 mA
Test Conditions
VCE = 2 V
IC = 500 mA
Test Conditions
VCE = 2 V
IC = 1 A
Test Conditions
VCE = 2 V
IC = 3 A
Test Conditions
IE = 10 µA
Test Conditions
VEB = 5 V
Test Conditions
VCB = 10 V
f = 1 MHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMXT3090L BK | Box@3,500 | Discontinued, Stock Only | 15V,3A,350mW Surface mount Transistor-Bipolar Power (>1A) NPN Low VCE(SAT) | EAR99 | 8541.21.0075 | PBFREE | |
| CMXT3090L TR | Tape & Reel@3,000 | Discontinued, Stock Only | 15V,3A,350mW Surface mount Transistor-Bipolar Power (>1A) NPN Low VCE(SAT) | EAR99 | 8541.21.0075 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| CMXT3090L.PDF | Device Datasheet |
| Material Composition:SOT-26 | Material Composition |
| Package Detail Document:SOT-26 | Package Detail Document |
| Product Reliability Data:SOT-26 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-26 | Step File 3D Object |
Product Support
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Design Support
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- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development