CZT955

140V,4A,3W Surface mount Transistor-Bipolar Power (>1A) PNP Low VCE(SAT)

Case Type: SOT-223

Base-Emitter On Voltage (VBE(ON))
930 mV

(830 mV Typical)

Base-Emitter Saturation Voltage (VBE(SAT))
1.04 V

(0.96 V Typical)

Collector-Base Breakdown Voltage (BVCBO)
180 V

(200 V Typical)

Collector-Base Cutoff Current (ICBO)
20 nA
Collector-Base Cutoff Current (ICBO)
0.5 µA
Collector-Base Voltage (VCBO)
180 V
Collector-Emitter Breakdown Voltage (BVCER)
180 V

(200 V Typical)

Collector-Emitter Breakdown Voltage (BVCEO)
140 V

(160 V Typical)

Collector-Emitter Cutoff Current (ICER)
20 nA
Collector-Emitter Saturation Voltage (VCE(SAT))
60 mV

(40 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
80 mV

(55 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
120 mV

(85 mV Typical)

Collector-Emitter Saturation Voltage (VCE(SAT))
360 mV

(210 mV Typical)

Collector-Emitter Voltage (VCEO)
140 V
Continuous Collector Current (IC)
4 A
Current Gain-Bandwidth Product (fT)
200 MHz
DC Current Gain (hFE)
100

(250 Typical)

DC Current Gain (hFE)
100 — 300

(220 Typical)

DC Current Gain (hFE)
35
DC Current Gain (hFE)
5
Emitter-Base Breakdown Voltage (BVEBO)
7 V

(8 V Typical)

Emitter-Base Cutoff Current (IEBO)
10 nA
Emitter-Base Voltage (VEBO)
7 V
Junction Temperature (Tj)
-65 — 150 °C
Output Capacitance (Cob)
33 pF
Peak Collector Current (ICM)
10 A
Power Dissipation (PD)
3 W
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
41.7 °C/W
Turn Off Time (toff)
410 ns
Turn On Time (ton)
25 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CZT955 BK Box@350 End Of Life 140V,4A,3W Surface mount Transistor-Bipolar Power (>1A) PNP Low VCE(SAT) EAR99 8541.29.0075 PBFREE
CZT955 TR Tape & Reel@1,000 End Of Life 140V,4A,3W Surface mount Transistor-Bipolar Power (>1A) PNP Low VCE(SAT) EAR99 8541.29.0075 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CZT955.PDF Device Datasheet
Material Composition:SOT-223 Material Composition
Package Detail Document:SOT-223 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-223 Process Change Notice
Product EOL Notice:All devices in SOT-223 Case Product EOL Notice
Product Reliability Data:SOT-223 Package Reliability Product Reliability Data
Spice Model:Spice Model CZT955 Spice Model
Step File 3D Object:SOT-223 Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development