Ruggedized
Semiconductor devices for harsh environments
Designed for extreme environments
As a leading manufacturer of high-reliability components for use in mission-critical applications, Central Semiconductor has developed a line of Ruggedized discrete semiconductors for extreme environments.
These devices with a superior design provide engineers the peace of mind for applications where failure is not an option.
Superior construction
The ruggedized family of semiconductors are built with the following design elements:
- Alloy 42 copper plated lead frame
- Eutectic die attach
- 0.8 mil gold wire bond
- Silver free package
- Pb/Sn lead plating available