Special Wafer Diffusion & Metallization
Advanced Wafer Diffusion & Metallization Solutions
When standard approaches don't meet your precise specifications, Central Semiconductor offers specialized water diffusion and metallization services to achieve optical performance of your devices. With our expertise and partnership, you gain access to solutions designed for superior quality and reliability where conventional options fall short.
Tailored Wafer Diffusion
For unique electrical requirements, our special wafer diffusion options are specially engineered to yield the exact specifications your device demands.
We go beyond conventional methods to ensure your wafers achieve precise electrical characteristics necessary for even the most challenging applications.
Custom Metallization options
Our advanced metallization capabilities include:
- Custom backside metallization: We can apply specific backside metallization layers to significantly improve solderability, ensuring robust and reliable connections for your components.
- Selective metal removal: When certain metals interfere with device functionality or subsequence processing, we can perform precision removal of specific metals from your wafer process for optimized performance and compatibility.