1N4753A

36V,1W Through-Hole Diode-Zener Single: Standard

Case Type: DO-41

Forward Voltage (VF)
1.2 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
125 mA
Power Dissipation (PD)
1 W
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
50 Ω
Zener Knee Impedance (ZZK)
1000 Ω
Zener Voltage (VZ)
34.2 — 37.8 V

(36 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
1N4753A BK Box@2,000 Active 36V,1W Through-Hole Diode-Zener Single: Standard EAR99 8541.10.0050 LEAD or TIN
1N4753A TR Tape & Reel@5,000 Active 36V,1W Through-Hole Diode-Zener Single: Standard EAR99 8541.10.0050 LEAD or TIN

Resources

1N4728A-4764A.PDF Device Datasheet
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:INK Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-41 Material Composition
Package Detail Document:DO-41 Package Detail Document
Process Change Notice:AXIAL LEAD PRODUCTS Process Change Notice
Product Reliability Data:DO-41 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development